Memory technologies are moving beyond traditional DRAM and NAND. Engineers specializing in 3D-stacked memory, HBM (High Bandwidth Memory), MRAM, ReRAM, and phase-change memory are in high demand. These roles require expertise in thermal management, TSV integration, latency optimization, and endurance modeling. Companies like Micron, Samsung, Western Digital, and Indian memory R&D labs... https://bestnanotech.in/candidate/